Philips Semiconductors

BSP030

N-channel enhancement mode field-effect transistor

Product specification

Rev. 04 — 26 July 2000

4 of 13

9397 750 07268

© Philips Electronics N.V. 2000. All rights reserved.

7.

Thermal characteristics

7.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol

Parameter

Conditions

Value

Unit

Rth(j-sp)

thermal resistance from junction to solder

point

mounted on a metal clad substrate;

Figure 4

15

K/W

Rth(j-a)

thermal resistance from junction to ambient

mounted on a printed circuit board;

minimum footprint

100

K/W

Mounted on a metal clad substrate.

Fig 4.

Transient thermal impedance from junction to solder point as a function of

pulse duration.

03ac21

10-2

10-1

1

10

102

10-5

10-4

10-3

10-2

10-1

110

tp (s)

Zth(j-sp)

(K/W)

single pulse

δ = 0.5

0.2

0.1

0.05

0.02

tp

tp

T

P

t

T

δ =