IMX7DCEC datasheet(22/161 Pages) NXP

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Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 7, 09/2023

NXP Semiconductors

4.1.2

Thermal resistance

4.1.2.1

FPBGA case “X” and case “Y” package thermal resistance

Table 8 displays the thermal resistance data.

Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance

comparison of one package to another in a standardized environment. This methodology is not meant to

and does not predict the performance of a package in an application-specific environment.

USB_OTG1_CHD_B open-drain pullup voltage

when external pullup resistor is connected to any

supply other than VDD_USB_OTG1_3P3_IN

USB_OTG2_CHD_B

—

1.975

Input/output voltage range

Vin/Vout

–0.3

OVDD1+0.3

ESD damage immunity:

Vesd

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage temperature range

TSTORAGE

–40

150

1 OVDD is the I/O supply voltage.

Table 8. Thermal Resistance Data

Rating

Test conditions

Symbol

12x12

pkg value

19x19

pkg value Unit

Junction to Ambient1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Single-layer board (1s); natural convection2

Four-layer board (2s2p); natural convection2

2 Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

RJA

55.4

32.6

44.4

30.2

oC/W

Junction to Ambient1

Single-layer board (1s); airflow 200 ft/min2,3

Four-layer board (2s2p); airflow 200 ft/min2,3

3 Per JEDEC JESD51-6 with the board horizontal.

RJA

41.8

28.0

34.3

25.8

oC/W

Junction to Board1,4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—

RJB

16.0

17.4

oC/W

Junction to Case1,5

—

RJC

10.5

10.4

oC/W

Junction to Package Top1,6

Natural Convection

JT

0.2

oC/W

Junction to Package Bottom

Natural Convection

RB_CSB

15.3

17.3

oC/W

Table 7. Absolute maximum ratings(continued)

Parameter Description

Symbol

Min

Max

Unit

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