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PCF8579 Datasheet(PDF) 31 Page - NXP Semiconductors |
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PCF8579 Datasheet(HTML) 31 Page - NXP Semiconductors |
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31 / 40 page ![]() 1997 Apr 01 31 Philips Semiconductors Product specification LCD column driver for dot matrix graphic displays PCF8579 15 CHIP DIMENSIONS AND BONDING PAD LOCATIONS Chip area: 14.37 mm2. Bonding pad dimensions: 120 µm × 120 µm. Gold bump dimensions (if ordered): 94 × 94 × 25 µm. The numbers given in the square boxes refer to the pad number. MSA920 PCF8579 4.76 mm 3.02 mm VLCD A2 n.c. V3 V4 C39 C38 C37 C36 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 VDD A1 A0 x y 0 0 56 1 255 54 53 52 51 50 3 4 5 6 7 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 Fig.24 Bonding pad locations. |
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