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PCF8579 Datasheet(PDF) 32 Page - NXP Semiconductors |
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PCF8579 Datasheet(HTML) 32 Page - NXP Semiconductors |
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32 / 40 page ![]() 1997 Apr 01 32 Philips Semiconductors Product specification LCD column driver for dot matrix graphic displays PCF8579 Table 12 Bonding pad locations (dimensions in µm) All x/y coordinates are referenced to centre of chip, see Fig.24. PAD NUMBER SYMBOL x y PINS VSO56 LQFP64 1 SDA 252 2142 1 7 2 SCL 48 2142 2 8 3 SYNC −156 2142 3 9 4 CLK −360 2142 4 10 5VSS −564 2142 5 11 6 TEST −786 2142 6 12 7 SA0 −1032 2142 7 13 8A3 −1314 2142 8 14 9A2 −1314 1920 9 16 10 A1 −1314 1716 10 17 11 A0 −1314 1512 11 18 12 VDD −1314 708 12 20 13 n.c. −1314 504 13 21 14 V3 −1314 300 14 22 15 V4 −1314 96 15 23 16 VLCD −1314 −108 16 24 17 C39 −1314 −1308 17 30 18 C38 −1314 −1512 18 31 19 C37 −1314 −1716 19 32 20 C36 −1314 −1920 20 33 21 C35 −1314 −2142 21 35 22 C34 −1032 −2142 22 36 23 C33 −786 −2142 23 37 24 C32 −564 −2142 24 38 25 C31 −360 −2142 25 39 26 C30 −156 −2142 26 40 27 C29 48 −2142 27 41 28 C28 252 −2142 28 42 29 C27 498 −2142 29 43 30 C26 702 −2142 30 44 31 C25 906 −2142 31 45 32 C24 1110 −2142 32 46 33 C23 1314 −2142 33 47 34 C22 1314 −1830 34 48 35 C21 1314 −1570 35 49 36 C20 1314 −1326 36 50 37 C19 1314 −1122 37 51 |
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