TUSB2E221 datasheet(54/65 Pages) TI

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, USB 2.0 Board Design and Layout Guidelines

• Texas Instruments, High-Speed Layout Guidelines

• Texas Instruments, High-Speed Interface Layout Guidelines

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

11.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Revision History

Changes from Revision A (October 2024) to Revision B (November 2024)

Page

• Added RAP address for writes......................................................................................................................... 31

Changes from Revision * (June 2024) to Revision A (October 2024)

Page

• Changed data sheet status from: Advanced Information to: Production Mixed..................................................1

• Changed YCG (DSBGA, 25) package status from: preview to: active............................................................... 1

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TUSB2E221

SNLS757B – JUNE 2024 – REVISED NOVEMBER 2024

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