PIC16F84AT-20SLASHSSROM datasheet(53/88 Pages) MICROCHIP

53 / 88 page

DS35007B-page 51

PIC16F84A

9.1

DC Characteristics

PIC16LF84A-04

(Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

°C ≤ TA ≤ +70°C (commercial)

-40

°C ≤ TA ≤ +85°C (industrial)

-40

°C ≤ TA ≤ +125°C (extended)

PIC16F84A-04

(Commercial, Industrial, Extended)

PIC16F84A-20

(Commercial, Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

°C ≤ TA ≤ +70°C (commercial)

-40

°C ≤ TA ≤ +85°C (industrial)

-40

°C ≤ TA ≤ +125°C (extended)

Param

No.

Symbol

Characteristic

Min

Typ† Max Units

Conditions

VDD

Supply Voltage

D001

16LF84A

2.0

—

5.5

XT, RC, and LP osc configuration

D001

D001A

16F84A

4.0

4.5

—

5.5

XT, RC and LP osc configuration

HS osc configuration

D002

VDR

RAM Data Retention

Voltage (Note 1)

1.5

—

Device in SLEEP mode

D003

VPOR

VDD Start Voltage to ensure

internal Power-on Reset

signal

—

Vss

—

See section on Power-on Reset for details

D004

SVDD

VDD Rise Rate to ensure

internal Power-on Reset

signal

0.05

—

V/ms

IDD

Supply Current (Note 2)

D010

16LF84A

—

RC and XT osc configuration (Note 4)

FOSC = 2.0 MHz, VDD = 5.5V

D010

D010A

D013

16F84A

—

1.8

4.5

RC and XT osc configuration (Note 4)

FOSC = 4.0 MHz, VDD = 5.5V

RC and XT osc configuration (Note 4)

FOSC = 4.0 MHz, VDD = 5.5V

(During FLASH programming)

HS osc configuration (PIC16F84A-20)

FOSC = 20 MHz, VDD = 5.5V

D014

16LF84A

—

µA LP osc configuration

FOSC = 32 kHz, VDD = 2.0V, WDT disabled

Legend: Rows with standard voltage device data only are shaded for improved readability.

†

Data in "Typ" column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Not rated for operation.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD,

T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be

estimated by the formula IR = VDD/2REXT (mA) with REXT in kOhm.

5: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD measurement.

PIC16F84AT-20/SSROM Datasheet(PDF) 53 Page - Microchip Technology

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