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TDA8026ET/C2 Datasheet(PDF) 40 Page - NXP Semiconductors

Part # TDA8026ET/C2
Description  Multiple smart card slot interface IC
PDF  61 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TDA8026ET/C2 Datasheet(HTML) 40 Page - NXP Semiconductors

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TDA8026_1
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 1.1 — 30 June 2016
40 of 61
NXP Semiconductors
TDA8026
Multiple smart card slot interface IC
9.
Limiting values
[1]
The limiting values depend on the external inductor and VUP decoupling capacitor used.
[2]
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the
remaining. Method 3015 (HBM; 1500
; 100 pF) defines three pulses positive and three pulses negative on
each pin referenced to ground.
[3]
The 7 kV ESD test is performed in the typical application configuration as depicted in the Application note
AN10724 with two external capacitors connected to each VCC(n) line.
10. Thermal characteristics
[1]
With a 4-layer board
Table 40.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
on pin VDD
0.5
+6
V
VDD(INTF)
interface supply
voltage
on pin VDD(INTF)
0.5
+4.6
V
VIH
HIGH-level input
voltage
on all card pins
0.5
+6
V
on all other pins
0.5
+4.6
V
Vo
output voltage
on pin LX
[1]
0.5
+7.2
V
DC-to-DC converter output on pin
VUP
[1]
0.5
+7.2
V
Ptot
total power
dissipation
Tamb = 25 C to +85 C
-
665
mW
Tstg
storage
temperature
55
+150
C
VESD
electrostatic
discharge voltage
HBM
[2]
on I/O(n), VCC(n), CLK(n), GNDC(n),
PRES, RST(n), C4(1), C8(1) card
pins
[3]
7
+7
kV
on all other pins
2
+2
kV
MM
on all pins
200
+200
V
CDM
on all pins
500
+500
V
Table 41.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
[1] 47.1
K/W



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