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STM32L496QGI3 Datasheet(PDF) 237 Page - STMicroelectronics

Part # STM32L496QGI3
Description  Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 1MB Flash, 320KB SRAM, USB OTG FS, audio, ext. SMPS
PDF  262 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L496QGI3 Datasheet(HTML) 237 Page - STMicroelectronics

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STM32L496xx
Package information
259
Figure 59. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array recommended footprint
Note:
Non-solder mask defined (NSMD) pads are recommended.
Note:
4 to 6 mils solder paste screen printing process.
b
0.230
0.280
0.330
0.0091
0.0110
0.0130
D
6.950
7.000
7.050
0.2736
0.2756
0.2776
D1
5.950
6.000
6.050
0.2343
0.2362
0.2382
E
6.950
7.000
7.050
0.2736
0.2756
0.2776
E1
5.950
6.000
6.050
0.2343
0.2362
0.2382
e
-
0.500
-
-
0.0197
-
F
0.450
0.500
0.550
0.0177
0.0197
0.0217
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 121. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5 mm
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste
0.27 mm aperture diameter.
Table 120. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.



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