Time (2.5µs/div)

OPA551

OPA551, OPA552

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SBOS100B – JULY 1999 – REVISED JANUARY 2016

Typical Application (continued)

8.2.3 Application Curve

Figure 33 shows the small-signal step response for the circuit in Figure 28. Consult AB-028 for more information.

Figure 33. Small-Signal Step Response for Driving Large Capacitive Loads

9 Power Supply Recommendations

9.1 Power Supplies

The OPA55x may be operated from power supplies of ±4 V to ±30 V, or a total of 60 V with excellent

performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters that

vary significantly with operating voltage are shown in the Typical Characteristics.

For applications that do not require symmetrical output voltage swing, power-supply voltages do not need to be

equal. The OPA55x can operate with as little as 8 V between the supplies or with up to 60 V between the

supplies. For example, the positive supply could be set to 50 V with the negative supply at –10 V, or vice-versa.

The SOIC-8 package outline shows three negative supply (V–) pins. These pins are internally connected for

improved thermal performance.

NOTE

Pin 4 must be used as the primary current carrier for the negative supply. It is

recommended that pins 1 and 5 are not directly connected to V–. Instead, connect pins 1

and 5 to a thermal mass. DO NOT lay out the printed-circuit-board (PCB) to use pins 1

and 5 as feedthroughs to the negative supply. Such a configuration results in a

performance reduction.

The tab of the DDPAK/TO-263 package is electrically connected to the negative supply (V–). However, this

connection must not be used to carry current. For best thermal performance, solder the tab directly to the PCB

copper area (see the Heat Sinking section).

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