OPA551, OPA552

SBOS100B – JULY 1999 – REVISED JANUARY 2016

www.ti.com

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

(1)

For improved thermal performance, increase footprint area.

(2)

Mean dimensions in inches. Refer to the mechanical drawings or www.ti.com for tolerances and detailed package

drawings.

Figure 40. TO-220 and DDPAK Solder Footprints

22

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