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STM32U073RCT6 Datasheet(PDF) 111 Page - STMicroelectronics |
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STM32U073RCT6 Datasheet(HTML) 111 Page - STMicroelectronics |
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111 / 146 page ![]() 7.2 UFQFPN32 package information (A0B8) This UFQFPN is a 32 pins, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package. Figure 34. UFQFPN32 - Outline D2 e E2 L e BOTTOM VIEW PIN 1 identifier Chamfer or Circular arc shape EXPOSED PAD FRONT VIEW C SEATING PLANE SEATING PLANE C ddd DETAIL A DETAIL A PIN 1 IDENTIFIER LASER MARKING AREA E D TOP VIEW fff C A B fff C A B b bbb C A B ddd C R0.20 eee C A1 A3 A ccc C A1 A3 C B A 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. STM32U073x8/B/C Package information DS14548 - Rev 2 page 111/146 |
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