© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSQ211 Rev. 1.0.0

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only. TA=25°C unless otherwise specified.

Symbol

Parameter

Value

Unit

VDRAIN

Drain Pin Voltage

650

V

VSTR

Vstr Pin Voltage

650

V

VDG

Drain-Gate Voltage

650

V

VGS

Gate-Source Voltage

±

20

V

VCC

Supply Voltage

20

V

VFB

Feedback Voltage Range

-0.3 to VSTOP

V

PD

Total Power Dissipation

1.40

W

TJ

Operating Junction Temperature

Internally limited

°C

TA

Operating Ambient Temperature

-25 to +85

°C

TSTG

Storage Temperature

-55 to +150

°C

Notes:

1.

Repetitive rating: Pulse width is limited by maximum junction temperature.

2.

L = 24mH, starting TJ = 25°C.

Thermal Impedance

TA=25°C unless otherwise specified.

Symbol

Parameter

Value

Unit

8DIP

θJA

Junction-to-Ambient Thermal Impedance

(3)

89

°C/W

θJC

Junction-to-Case Thermal Impedance

(4)

14

°C/W

Notes:

3.

Free standing with no heatsink; without copper clad. Measurement condition – Just before junction temperature

TJ enters into OTP.

4.

Measured on the DRAIN pin close to plastic interface.

5.

All items are tested with the JEDEC standards: JESD 51-2 and 51-10 (DIP).