DS6143 Rev 13

17/24

L5300AH7

Package and PC board thermal data

23

4

Package and PC board thermal data

4.1

HPAK thermal data

Figure 25.PC board

Figure 26.Rthj-amb vs PCB copper area in open box free air condition

Note:



Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10 %; Board double layer; Board dimension

78 mm x 86 mm; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation 1.2 mm; Thermal

via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 6.4 mm x 7 mm).

30

40

50

60

70

80

90

02468

10

RTHjamb

RTHjamb

GAPGCFT00131