Package and PC board thermal data

L5300AH7

18/24

DS6143 Rev 13

Figure 27.HPAK thermal impedance junction ambient single pulse

Figure 28.Thermal fitting model of a single-channel HSD in HPAK

1

10

100

0.01

0.1

1

10

100

1000

ZTH (°C/W)

Time (s)

Cu=8 cm2

Cu=2 cm2

Cu=f oot print

GAPGCFT00132

GAPGCFT 00133

Note:



The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power

limitation or thermal cycling during thermal shutdown) are not triggered.