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RC21 Datasheet(PDF) 9 Page - NXP Semiconductors |
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RC21 Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 11 page ![]() TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the schedule of “IEC publication 115-8”, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. The tests are carried out in accordance with IEC publication 68, “Recommended basic climatic and mechanical robustness testing procedure for electronic components” and under standard atmospheric conditions according to “IEC 68-1”, subclause 5.3. Unless otherwise specified the following values apply: Temperature: 15 °Cto35 °C Relative humidity: 45% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 115-8 and 68”; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Table 4 Test procedures and requirements IEC 115-8 CLAUSE IEC 68-2 TEST METHOD TEST PROCEDURE RESISTANCE RANGE REQUIREMENTS RC01 RC11 RC21 RC31 Tests in accordance with the schedule of IEC publication 115-8 4.4.1 visual examination no holes; clean surface; no damage 4.4.2 dimensions (outline; see Fig.11) gauge (mm) 0.45 ≤ T ≤ 0.65 0.45 ≤ T ≤ 0.65 0.35 ≤ T ≤ 0.55 0.30 ≤ T ≤ 0.40 1.45 ≤ W ≤ 1.75 1.10 ≤ W ≤ 1.40 0.75 ≤ W ≤ 0.95 0.45 ≤ W ≤ 0.55 3.0 ≤ L ≤ 3.3 1.85 ≤ L ≤ 2.15 1.50 ≤ L ≤ 1.70 0.95 ≤ L ≤ 1.05 4.5 resistance applied voltage (+0/ −10%): R − Rnom: max. ±2% or R − Rnom: max. ±5% R − Rnom: max. ±5% R<10 Ω: 0.1 V 10 Ω≤ R < 100 Ω: 0.3 V 100 Ω≤ R<1kΩ:1V 1k Ω≤ R < 10 kΩ:3V 10 k Ω≤ R < 100 kΩ:10V 100 k Ω≤ R<1MΩ:25V R ≥ 1MΩ:50V |
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