4.24.2

3 (Ca)

damp heat

(steady state)

(IEC)

56 days; 40

°C; 90 to 95% RH;

(IEC steps: 4 to 100 V)

R

≤ 1MΩ∆R/R max.:

±1.5% +0.1 Ω

∆R/R max.:

±3% +0.1 Ω

R>1M

Ω∆R/R max.: ±3% +0.1 Ω

not applicable

4.25.1

endurance

(at 70

°C)

1.5 hours on and 0.5 hours off

R

≤ 1MΩ∆R/R max.:

±1.5% +0.1 Ω

∆R/R max.:

±3% +0.1 Ω

R>1M

Ω∆R/R max.: ±3% +0.1 Ω

not applicable

4.23.2

27 (Ba)

endurance at

upper category

temperature

1000 hours; no load

R

≤ 1MΩ∆R/R max.:

±1.5% +0.1 Ω

∆R/R max.:

±3% +0.1 Ω

R>1M

Ω∆R/R max.: ±3% +0.1 Ω

not applicable

4.8.4.2

temperature

coefficient

at 20/LCT/20

°C and 20/UCT/20 °C

(TC

R<5

Ω≤ ±250

not applicable

R

≤ 10 MΩ≤ ±200

≤±200

Other tests in accordance with IEC 115 clauses and IEC 68 test method

4.17

20 (Tb)

solderability

(after ageing)

8 hours steam or 16 hours 155

°C;

unmounted chips completely

immersed for 2

±0.5 s in a solder

bath at 235

±5 °C

good tinning (

≥95% covered); no damage

4.6.1.1

insulation

resistance

voltage (DC) after 1 minute,

metal block method:

100 V for RC01 and RC11,

50 V for RC21 and RC31

4.12

noise

IEC publication 195

(measured with Quantech -

equipment)

R

≤ 1kΩ

max. 1

µV/V

R

≤ 10 kΩ

max. 3

µV/V

R

≤ 100 kΩ

max. 6

µV/V

R

≤ 1MΩ

max. 10

µV/V

Other applicable tests

humidity load

(steady state)

(JIS)

1000 hours; +40

°C; 90 to 95% RH;

1.5 hours on and 0.5 hours off

R

≤ 1MΩ∆R/R max.: ±3% +0.1 Ω

R>1M

Ω∆R/R max.: ±5% +0.1 Ω

not applicable

leaching

unmounted chips; 60 s; 260

±5 °C

good tinning; no leaching

trio damp heat

test

1 000 hours; +85

°C; 85% RH;

R

≤ 1MΩ∆R/R max.: ±3% +0.1 Ω

R>1M

Ω∆R/R max.: ±5% +0.1 Ω

not applicable

IEC

115-8

CLAUSE

IEC 68-2

TEST

METHOD

TEST

PROCEDURE

RESISTANCE

RANGE

REQUIREMENTS

RC01

RC11

RC21

RC31