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AAT3603 Datasheet(PDF) 32 Page - Advanced Analogic Technologies |
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AAT3603 Datasheet(HTML) 32 Page - Advanced Analogic Technologies |
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32 / 35 page ![]() AAT3603178 Total Power Solution for Portable Applications PRODUCT DATASHEET 32 3603.2008.06.1.0 www .analogictech.com LDO11 LDO10 LDO1 Output Voltage 0 0 3.00V (default) 0 1 2.90V 1 0 2.85V 1 1 2.80V LDO21 LDO20 LDO2 Output Voltage 0 0 3.00V (default) 0 1 2.90V 1 0 2.85V 1 1 2.80V LDO31 LDO30 LDO3 Output Voltage 0 0 3.00V (default) 0 1 2.90V 1 0 2.85V 1 1 2.80V LDO41 LDO40 LDO4 Output Voltage 0 0 3.00V (default) 0 1 2.90V 1 0 2.85V 1 1 2.80V LDO51 LDO50 LDO5 Output Voltage 0 0 3.00V (default) 0 1 2.90V 1 0 2.85V 1 1 2.80V Table 7: LDO Bit Setting for LDO Output Voltage Level. Layout Guidance Figure 10 is the schematic for the evaluation board. The evaluation board has extra components for easy evalua- tion; the actual BOM need for a system is shown in Table 9. When laying out the PC board, the following layout guideline should be followed to ensure proper operation of the AAT3603: 1. The exposed pad EP must be reliably soldered to PGND/AGND and multilayer GND. The exposed ther- mal pad should be connected to board ground plane and pins 2 and 16. The ground plane should include a large exposed copper pad under the package with VIAs to all board layers for thermal dissipation. 2. The power traces, including GND traces, the LX traces and the VIN trace should be kept short, direct and wide to allow large current flow. The L1 connec- tion to the LX pins should be as short as possible. Use several via pads when routing between layers. 3. The input capacitors (C1 and C2) should be con- nected as close as possible to CHGIN (Pin 28) and PGND (Pin 2) to get good power filtering. 4. Keep the switching node LX away from the sensitive OUTBUCK feedback node. 5. The feedback trace for the OUTBUCK pin should be separate from any power trace and connected as closely as possible to the load point. Sensing along a high current load trace will degrade DC load regula- tion. 6. The output capacitor C4 and L1 should be connected as close as possible and there should not be any signal lines under the inductor. 7. The resistance of the trace from the load return to the PGND (Pin 2) should be kept to a minimum. This will help to minimize any error in DC regulation due to differences in the potential of the internal signal ground and the power ground. Quantity Value Designator Footprint Description 510μF C1, C2, C3, C14, C15 0603 Capacitor, Ceramic, X5R, 6.3V, ±20% 222μF C9 0805 Capacitor, Ceramic, 20%, 6.3V, X5R 4 4.7μF C4, C5, C6, C7, C8 0603 Capacitor, Ceramic, 20%, 6.3V, X5R 3 0.1μF C10, C11, C12 0402 Capacitor, Ceramic, 16V, 10%, X5R 1 0.01μF C13 0402 Capacitor, Ceramic, 16V, 10%, X7R 1 3.3μH L1 CDRH2D Inductor, Sumida CDRH2D11NP-3R3NC 9 100K R5, R8, R20, R21, R22, R23, R25, R26, R27 0402 Resistor, 5% 8 10K R17, R19, R24, R29, R31, R32, R33, R37 0402 Resistor, 5% 1 1.24K R18 0402 Resistor, 1% Table 8: Minimum AAT3603 Bill of Materials. |
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