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TDF8599TH Datasheet(PDF) 27 Page - NXP Semiconductors

Part # TDF8599TH
Description  I2C-bus controlled dual channel 43 W/2 W single channel 85 W/1 W class-D power amplifier with load diagnostics
PDF  52 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TDF8599TH Datasheet(HTML) 27 Page - NXP Semiconductors

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TDF8599_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 November 2008
27 of 52
NXP Semiconductors
TDF8599
Class-D power amplifier with load diagnostics
10. Limiting values
[1]
Floating condition assumed for outputs.
[2]
Current limiting concept.
[3]
Human Body Model (HBM).
[4]
Charged-Device Model (CDM).
[5]
The output pins are defined as the output pins of the filter connected between the TDF8599 output pins and
the load.
11. Thermal characteristics
Table 17.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VP
supply voltage
Operating mode
-
18
V
off state
[1]
−150
V
load dump; duration
50 ms, tr >2.5 ms
-50
V
IORM
repetitive peak output
current
maximum output current
limiting
[2] 8-
A
IOM
peak output current
maximum; non-repetitive
[2] -12
A
Vi
input voltage
pins SCL, SDA, ADS,
MOD, SSM, OSCIO, EN
and SEL_MUTE
0
5.5
V
Vo
output voltage
pins DIAG and CLIP
0
10
V
Tj
junction temperature
-
150
°C
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
VESD
electrostatic discharge
voltage
HBM
[3]
C = 100 pF;
Rs = 1500 Ω
-
2000
V
CDM
[4]
non-corner pins
-
500
V
corner pins
-
750
V
V(prot)
protection voltage
AC and DC short circuit
voltage of output pins
across load and to
supply and ground
[5] 0Vp
V
Pmax
maximum power dissipation
Tcase =70 °C
-
15
W
Table 18.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air
35
K/W
Rth(j-c)
thermal resistance from junction
to case
1
K/W



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