2-2
RF2938
Rev A8 010418
11
Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage
-0.5 to +3.6
VDC
Control Voltages
-0.5 to +3.6
VDC
Input RF Level
+12
dBm
LO Input Levels
+5
dBm
Operating Ambient Temperature
-40 to +85
°C
Storage Temperature
-40 to +150
°C
Moisture Sensitivity
JEDEC Level 5 @ 220°C
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Overall Receiver
T=25 °C, VCC=3.3V, Freq=280MHz,
RBW=10kΩ
RX Frequency Range
45
500
MHz
Cascaded Voltage Gain
8 to 93
dB
Dependent upon RX VGC
Cascaded Noise Figure
5
dB
At maximum gain.
Cascaded Input IP3
30
dB
µVV
GC <1.2 V
Cascaded Input IP3
105
dB
µVV
GC>2.0 V
RSSI Dynamic Range
60
dB
At VGC=1.4V
RSSI Output Voltage Compli-
ance
1.1 to 2.3
V
Maximum RSSI is 2.5V or VCC-0.3, which-
ever is less. VGC=1.4V
IF LO Leakage
-68
dBm
f= 280MHz, LO Power =-10dBm
Quadrature Phase Variation
±2
±5
°
With expected LO amplitude and harmonic
content. R1= 270k
Ω.
Quadrature Amplitude Offset
+0.25
dB
Q> I
Quadrature Amplitude Variation
±0.25
+0.5
dB
IF AMP and Quad Demod
Gain Control Range
43
dB
VGC < 1.2V max gain, VGC>2.0V=min gain
Noise Figure
5
dB
Single Sideband
IF Input Impedance
230- j400
Ω
Single ended. 280MHz
75- j350
Ω
Single ended. 374MHz
Input IP3
-68
dBm
VGC<1.2V
-8
dBm
VGC>2.0V
RX Baseband Amplifiers
THD
3
%
At maximum gain setting
3
%
At minimum gain setting
Gain Control Range
30
dB
VGC<1.2V=max gain,
VGC>2.0V=min gain
Output Voltage
500
mVPP
RL>5kΩ,CL<5pF
DC Output Voltage
1.7
V
RX Baseband Filters
Baseband Filter 3dB Bandwidth
1
35
MHz
5th order Bessel LPF. Set by BW CTRL
Passband Ripple
0.1
dB
Baseband Filter 3dB Frequency
Accuracy
±10
±30
%
Group Delay
15
ns
At 35MHz, increasing as bandwidth
decreases.
Group Delay
400
ns
At 2MHz.
Baseband Filter Ultimate Rejec-
tion
>80
dB
Output Impedance
20
Ω
Designed to drive> 5k
Ω,<5pF load.
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Refer to “Handling of PSOP and PSSOP Products” on page 16-15 for
special handling information.
Refer to “Soldering Specifications” on page 16-13 for special solder-
ing information.
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