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TLE4247 Datasheet(PDF) 12 Page - Infineon Technologies AG |
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TLE4247 Datasheet(HTML) 12 Page - Infineon Technologies AG |
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12 / 14 page ![]() TLE4247 Package Outlines Datasheet 12 Rev. 1.01, 2010-05-04 6 Package Outlines Figure 6 PG-DSO-8 (exposed pad) Outline and recommended footprint for reflow soldering Green Product To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). PG-DSO-8-27-FP V01 5.69 1.31 2.65 PG-DSO-8-27-PO V01 14 85 8 14 5 8x 0.41±0.09 2) M 0.2 D C A-B 1.27 C 0.08 Seating Plane C A B 4.9±0.1 1) A-B C 0.1 2x 3) JEDEC reference MS-012 variation BA 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width Bottom View ±0.2 3 0.2 ±0.2 D 6 M D 8x 0.64 ±0.25 3.9±0.1 1) 0.1 0.35 x 45˚ CD 2x Index Marking For further information on Infineon packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm |
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