SPI Driver for Enhanced Relay Control

SPIDER - TLE7233G

General Product Characteristics

Datasheet

10

Rev. 1.0, 2008-02-28

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

4.2

Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards.

For more information, go to www.jedec.org.

4) ESD susceptibility, HBM according to EIA/JESD 22-A114B

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

Digital supply voltage

V

DD

3. 0

5.5

V

–

4.2.2

Analog supply voltage

V

DDA

4.5

5.5

V

–

4.2.3

Digital supply current all channels

ON

–0.5

mA

–

4.2.4

Analog supply current all channels

ON

–5

mA

–

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.5

Junction to Soldering Point

R

thJSP

–

–

29

K/W

1) Specified

R

T

4.3.6

Junction to Ambient

R

thJA

–47

–

K/W

1)2)

2) Specified

R

(Chip+Package PG-SSOP-24) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70

µm Cu,

2 x 35