PCF2129A_10 datasheet(52/69 Pages) NXP

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PCF2129A_2

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Product data sheet

Rev. 02 — 7 May 2010

52 of 69

NXP Semiconductors

PCF2129A

Integrated RTC, TCXO and quartz crystal

11. Limiting values

[1]

Pass level; Human Body Model (HBM) according to Ref. 7 “JESD22-A114”.

[2]

Pass level; Machine Model (MM), according to Ref. 8 “JESD22-A115”.

[3]

Pass level; Charged-Device Model (CDM), according to Ref. 9 “JESD22-C101”.

[4]

Pass level; latch-up testing according to Ref. 10 “JESD78” at maximum ambient temperature (Tamb(max)).

[5]

According to the NXP store and transport requirements (see Ref. 12 “NX3-00092”) the devices have to be

stored at a temperature of +8

°C to +45 °C and a humidity of 25 % to 75 %. For long term storage products

deviant conditions are described in that document.

Table 51.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

−0.5

+4.5

IDD

supply current

−50

+50

input voltage

−0.5

+6.5

input current

−10

+10

output voltage

−0.5

+6.5

output current

−10

+10

at pin SDA/CE

−10

+20

VBAT

battery supply voltage

−0.5

+4.5

Ptot

total power dissipation

300

VESD

electrostatic discharge

voltage

HBM

[1] -

±3000

[2] -

±250

CDM

[3] -

±1500

Ilu

latch-up current

[4] -200

Tstg

storage temperature

[5]

−55

+85

°C

Toper

operating temperature

−40

+85

°C

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