MSP430F167IPMR datasheet(47/77 Pages) TI

47 / 77 page

MSP430F15x, MSP430F16x, MSP430F161x

MIXED SIGNAL MICROCONTROLLER

SLAS368G − OCTOBER 2002 − REVISED MARCH 2011

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature (unless otherwise

noted)

12-bit DAC, reference input specifications

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

Reference input

DAC12IR=0 (see Notes 1 and 2)

2.2V/3V

AVCC/3 AVCC+0.2

VeREF+

Reference input

voltage range

DAC12IR=1 (see Notes 3 and 4)

2.2V/3V

AVcc

AVcc+0.2

DAC12_0 IR = DAC12_1 IR = 0

2.2V/3V

DAC12_0 IR = 1, DAC12_1 IR = 0

2.2V/3V

Ri(VREF+),

Reference input

DAC12_0 IR = 0, DAC12_1 IR = 1

2.2V/3V

(VREF+)

Ri(VeREF+)

resistance

DAC12_0 IR = DAC12_1 IR =1,

DAC12_0 SREFx = DAC12_1 SREFx

(see Note 5)

2.2V/3V

NOTES:

1. For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).

2. The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC − VE(O)] / [3*(1 + EG)].

3. For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).

4. The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC − VE(O)] / (1 + EG).

5. When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel

reducing the reference input resistance.

12-bit DAC, dynamic specifications; Vref = VCC, DAC12IR = 1 (see Figure 23 and Figure 24)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

DAC12_xDAT = 800h,

DAC12AMPx = 0

→ {2, 3, 4}

2.2V/3V

120

tON

DAC12

on-time

ErrorV(O) < ±0.5 LSB

(see Note

DAC12AMPx = 0

→ {5, 6}

2.2V/3V

μs

on-time

(see Note

1,Figure 23)

DAC12AMPx = 0

→ 7

2.2V/3V

S ttli

DAC12

DAT

DAC12AMPx = 2

2.2V/3V

100

200

tS(FS)

Settling time,

full-scale

DAC12_xDAT =

80h

→ F7Fh→ 80h

DAC12AMPx = 3,5

2.2V/3V

μs

tS(FS)

full-scale

80h

→ F7Fh→ 80h

DAC12AMPx = 4,6,7

2.2V/3V

μs

S ttli

DAC12 xDAT =

DAC12AMPx = 2

2.2V/3V

tS(C-C)

Settling time,

code to code

DAC12_xDAT =

3F8h

→ 408h→ 3F8h

DAC12AMPx = 3,5

2.2V/3V

μs

tS(C-C)

code to code

3F8h

→ 408h→ 3F8h

BF8h

→ C08h→ BF8h

DAC12AMPx = 4,6,7

2.2V/3V

μs

DAC12

DAT

DAC12AMPx = 2

2.2V/3V

0.05

0.12

Slew rate

DAC12_xDAT =

80h

→ F7Fh→ 80h

DAC12AMPx = 3,5

2.2V/3V

0.35

0.7

μs

Slew rate

80h

→ F7Fh→ 80h

DAC12AMPx = 4,6,7

2.2V/3V

1.5

2.7

μs

DAC12

DAT

DAC12AMPx = 2

2.2V/3V

Glitch energy: full-scale

DAC12_xDAT =

80h

→ F7Fh→ 80h

DAC12AMPx = 3,5

2.2V/3V

nV-s

Glitch energy: full scale

80h

→ F7Fh→ 80h

DAC12AMPx = 4,6,7

2.2V/3V

nV s

NOTES:

1. RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 23.

2. Slew rate applies to output voltage steps

≥ 200mV.

RLoad

AVCC

CLoad = 100pF

DAC Output

RO/P(DAC12.x)

ILoad

Conversion 1

Conversion 2

VOUT

Conversion 3

Glitch

Energy

+/− 1/2 LSB

tsettleLH

tsettleHL

= 3 k

Figure 23. Settling Time and Glitch Energy Testing

MSP430F167IPMR Datasheet(PDF) 47 Page - Texas Instruments

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