MSP430F167IPMR datasheet(25/77 Pages) TI

25 / 77 page

MSP430F15x, MSP430F16x, MSP430F161x

MIXED SIGNAL MICROCONTROLLER

SLAS368G − OCTOBER 2002 − REVISED MARCH 2011

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Voltage applied at VCC to VSS

−0.3 V to 4.1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage applied to any pin (see Note)

−0.3 V to VCC + 0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Diode current at any device terminal .

±2 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg: Unprogrammed device

−55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Programmed device

−55

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE: All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied

to the TDI/TCLK pin when blowing the JTAG fuse.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage during program execution,

VCC (AVCC = DVCC = VCC)

MSP430F15x/16x/161x

1.8

3.6

Supply voltage during flash memory programming, VCC

(AVCC = DVCC = VCC)

MSP430F15x/16x/161x

2.7

3.6

Supply voltage during program execution, SVS enabled

(see Note 1), VCC (AVCC = DVCC = VCC)

MSP430F15x/16x/161x

3.6

Supply voltage, VSS (AVSS = DVSS = VSS)

Operating free-air temperature range, TA

MSP430F15x/16x/161x

−40

°C

LFXT1

t l f

LF selected, XTS=0

Watch crystal

32.768

kHz

LFXT1 crystal frequency, f(LFXT1)

(see Notes 2 and 3)

XT1 selected, XTS=1

Ceramic resonator

450

8000

kHz

(see Notes 2 and 3)

XT1 selected, XTS=1

Crystal

1000

8000

kHz

XT2 crystal frequency f

Ceramic resonator

450

8000

kHz

XT2 crystal frequency, f(XT2)

Crystal

1000

8000

kHz

Processor frequency (signal MCLK) f

VCC = 1.8 V

4.15

MHz

Processor frequency (signal MCLK), f(System)

VCC = 3.6 V

MHz

NOTES:

1. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply

voltage. POR is going inactive when the VCC is raised above the minimum supply voltage plus the hysteresis of the SVS circuitry.

2. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1-M

Ω resistor from XOUT to VSS is recommended when

VCC < 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15 MHz at VCC ≥ 2.2 V. In

XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8 MHz at VCC ≥ 2.8 V.

3. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.

f (MHz)

1.8 V

3.6 V

2.7 V 3 V

4.15 MHz

8.0 MHz

Supply Voltage − V

Supply voltage range,

’F15x/16x/161x,

during flash memory programming

Supply voltage range,

’F15x/16x/161x, during

program execution

Figure 1. Frequency vs Supply Voltage, MSP430F15x/16x/161x

MSP430F167IPMR Datasheet(PDF) 25 Page - Texas Instruments

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