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MPC5125 Datasheet(PDF) 88 Page - Freescale Semiconductor, Inc |
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MPC5125 Datasheet(HTML) 88 Page - Freescale Semiconductor, Inc |
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88 / 94 page ![]() MPC5125 Microcontroller Data Sheet, Rev. 4 Package Information Freescale Semiconductor 88 6 Package Information This section details package parameters and dimensions. The MPC5125 is available in a thermally enhanced plastic ball grid array (TEPBGA). Section 6.1, “Package Parameters,” and Section 6.2, “Mechanical Dimensions,” provide information on the TEPBGA. 6.1 Package Parameters Table 50. TEPBGA Parameters Package outline 23 mm 23 mm Interconnects 324 Pitch 1.00 mm Module height (typical) 2.25 mm Solder balls 96.5 Sn/3.5Ag (VN package) Ball diameter (typical) 0.6 mm |
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