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DSPIC30F4012 Datasheet(PDF) 227 Page - Microchip Technology

Part # DSPIC30F4012
Description  High-Performance, 16-Bit Digital Signal Controllers
PDF  238 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F4012 Datasheet(HTML) 227 Page - Microchip Technology

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© 2010 Microchip Technology Inc.
DS70135G-page 227
dsPIC30F4011/4012
APPENDIX A:
REVISION HISTORY
Revision D (August 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these changes:
•Revised I2C Slave Addresses
(see Table 17-1)
• Updated Section 20.0 “10-bit, High-Speed
Analog-to-Digital Converter (ADC) Module” to
more fully describe configuration guidelines
• Base Instruction CP1 removed from instruction
set (see Table 22-2)
• Revised Electrical Characteristics:
- Operating Current (IDD) Specifications
(seeTable 24-5)
- Idle Current (IIDLE) Specifications
(see Table 24-6)
- Power-Down Current (IPD) Specifications
(see Table 24-7)
- I/O Pin Input Specifications
(see Table 24-8)
- BOR Voltage Limits
(see Table 24-11)
- Watchdog Timer Time-out Limits
(see Table 24-21)
Revision E (January 2007)
- This revision includes updates to the
packaging diagrams.
Revision F (March 2008)
This revision reflects these updates:
• Added Note 1 to 32-bit Timer4/5 Block Diagram
(see Figure 11-1) and 16-bit Timer4/5 Block
Diagram (see Figure 11-2)
• Changed the location of the input reference in the
10-bit High-Speed ADC Functional Block Diagram
(see Figure 20-1)
• Added FUSE Configuration Register (FICD)
details (see Section 21.6 “Device Configuration
Registers” and Table 21-8)
• Removed erroneous statement regarding genera-
tion of CAN receive errors (see Section 19.4.5
“Receive Errors”)
• Electrical Specifications:
- Resolved TBD values for parameters DO10,
DO16, DO20, and DO26 (see Table 24-9)
- 10-bit High-Speed ADC tPDU timing parame-
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table 24-40)
- Parameter OS65 (Internal RC Accuracy) has
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table 24-18)
- Parameter DC12 (RAM Data Retention Volt-
age) has been updated to include a Min value
(see Table 24-4)
- Parameter D134 (Erase/Write Cycle Time)
has been updated to include Min and Max
values and the Typ value has been removed
(see Table 24-11)
- Removed parameters OS62 (Internal FRC
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table 24-17)
- Parameter OS63 (Internal FRC Accuracy)
has been expanded to reflect multiple Min
and Max values for different temperatures
(see Table 24-17)
- Updated Min and Max values and Conditions
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see Table 24-20)
• Corrected erroneous device number (see
“Product Identification System”)
• Additional minor corrections throughout the
document



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