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DSPIC30F4012 Datasheet(PDF) 227 Page - Microchip Technology |
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DSPIC30F4012 Datasheet(HTML) 227 Page - Microchip Technology |
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227 / 238 page ![]() © 2010 Microchip Technology Inc. DS70135G-page 227 dsPIC30F4011/4012 APPENDIX A: REVISION HISTORY Revision D (August 2006) Previous versions of this data sheet contained Advance or Preliminary Information. They were distributed with incomplete characterization data. This revision reflects these changes: •Revised I2C Slave Addresses (see Table 17-1) • Updated Section 20.0 “10-bit, High-Speed Analog-to-Digital Converter (ADC) Module” to more fully describe configuration guidelines • Base Instruction CP1 removed from instruction set (see Table 22-2) • Revised Electrical Characteristics: - Operating Current (IDD) Specifications (seeTable 24-5) - Idle Current (IIDLE) Specifications (see Table 24-6) - Power-Down Current (IPD) Specifications (see Table 24-7) - I/O Pin Input Specifications (see Table 24-8) - BOR Voltage Limits (see Table 24-11) - Watchdog Timer Time-out Limits (see Table 24-21) Revision E (January 2007) - This revision includes updates to the packaging diagrams. Revision F (March 2008) This revision reflects these updates: • Added Note 1 to 32-bit Timer4/5 Block Diagram (see Figure 11-1) and 16-bit Timer4/5 Block Diagram (see Figure 11-2) • Changed the location of the input reference in the 10-bit High-Speed ADC Functional Block Diagram (see Figure 20-1) • Added FUSE Configuration Register (FICD) details (see Section 21.6 “Device Configuration Registers” and Table 21-8) • Removed erroneous statement regarding genera- tion of CAN receive errors (see Section 19.4.5 “Receive Errors”) • Electrical Specifications: - Resolved TBD values for parameters DO10, DO16, DO20, and DO26 (see Table 24-9) - 10-bit High-Speed ADC tPDU timing parame- ter (time to stabilize) has been updated from 20 µs typical to 20 µs maximum (see Table 24-40) - Parameter OS65 (Internal RC Accuracy) has been expanded to reflect multiple Min and Max values for different temperatures (see Table 24-18) - Parameter DC12 (RAM Data Retention Volt- age) has been updated to include a Min value (see Table 24-4) - Parameter D134 (Erase/Write Cycle Time) has been updated to include Min and Max values and the Typ value has been removed (see Table 24-11) - Removed parameters OS62 (Internal FRC Jitter) and OS64 (Internal FRC Drift) and Note 2 from AC Characteristics (see Table 24-17) - Parameter OS63 (Internal FRC Accuracy) has been expanded to reflect multiple Min and Max values for different temperatures (see Table 24-17) - Updated Min and Max values and Conditions for parameter SY11 and updated Min, Typ, and Max values and Conditions for parame- ter SY20 (see Table 24-20) • Corrected erroneous device number (see “Product Identification System”) • Additional minor corrections throughout the document |
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