ML22Q563 datasheet(62/66 Pages) ETC2

62 / 66 page

FEDL2257X-05

ML22Q573/ML2257X

LIMITATION ON THE OPERATION TIME (PLAY-BACK TIME)

ML22Q573/ML22573’s operating temperature is 105℃. But the average ambient temperature at 1W play-back

(8ohm drive) during 10 years in the reliability design is Ta=55℃. (max ( the package heat resistance θ

ja=42.51[℃/W]) )

When ML22Q573/ML22573 operates 1W play-back(8ohm drive) consecutively, the product life changes by the

package temperature rise by the consumption. This limitation does not matter in the state that a speaker amplifier

does not play.

The factor to decide the operation time ( play-back time ) is the average ambient temperature( Ta ), play-back

Watts( at the speaker drive mode), the soldering area ratio*1, and so on. In addition, the limitation on the

operation time changes by the heat designs of the board.

PACKAGE HEAT RESISTANCE VALUE (REFERENCE VALUE)

The following table is the package heat resistance value θja (reference value).

This value changes the condition of the board (size, layer number, and so on)

The board

The condition

JEDEC 4layers

（

W/L/t＝76.2/114.5/1.6（mm））

42.51[℃/W]

JEDEC 2layers

（

W/L/t＝76.2/114.5/1.6（mm））

55.37[℃/W]

No wind (0m/sec)

the soldering area ratio*1：100%

*1 : The soldering area ratio is the ratio that the heat sink area of ML22Q573/ML22573 and a land pattern on

the board are soldered. 100% mean that the heat sink area of ML22Q573/ML22573 is completely soldered

to the land pattern on the board. About the land pattern on the board, be sure to refer to the next clause

(PACKAGE DIMENSIONS).

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ML22Q563 Datasheet(PDF) 62 Page - List of Unclassifed Manufacturers