ML22Q563 datasheet(63/66 Pages) ETC2

Part #	ML22Q563

Description	4-Channel Mixing Speech Synthesis LSI

PDF	66 Pages

Scroll/Zoom	100%

Manufacturer	ETC2 [List of Unclassifed Manufacturers]

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63 / 66 page

FEDL2257X-05

ML22Q573/ML2257X

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

Notes for heat sink type Package

This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land

pattern corresponding to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the

LSI solder open or GND on the board. Be sure to refer to the next clause reference data ( Mounting area for

package lead soldering to PC boards ).

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ML22Q563 Datasheet(PDF) 63 Page - List of Unclassifed Manufacturers