UPD705102 datasheet(76/80 Pages) NEC

76 / 80 page

µPD705102

Data Sheet U13675EJ2V1DS00

18. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales represen-

tative.

Table 18-1. Surface Mounting Type Soldering Conditions

µPD705102GM-143-8ED: 160-pin plastic LQFP (fine pitch) (24 × 24 mm)

µPD705102GM-133-8ED: 160-pin plastic LQFP (fine pitch) (24 × 24 mm)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

IR35-103-2

VPS

VP15-103-2

Partial heating

—

Note After opening dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Package peak temperature: 235

°C, Time: 30 sec. Max. (at 210°C or higher),

Count: two times or less, Exposure limit: 3 daysNote (after that, prebake 125

°C

for 10 hours)

Package peak temperature: 215

°C, Time: 40 sec. Max. (at 200°C or higher),

Count: two times or less, Exposure limit: 3 daysNote (after that, prebake 125

°C

for 10 hours)

Pin temperature: 300

°C Max., Time: 3 sec. Max. (per pin row)

UPD705102 Datasheet(PDF) 76 Page - NEC