PIC16F870SLASHP datasheet(122/156 Pages) MICROCHIP

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PIC16F870/871

DS30569A-page 122

Preliminary

14.2

DC Characteristics:

PIC16LF870/871 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

Supply Voltage

VDD

2.0

5.5

LP, XT, RC osc configuration (DC - 4 MHz)

D002*

RAM Data Retention

Voltage (Note 1)

VDR

-1.5

D003

VDD start voltage to

ensure internal Power-on

Reset signal

VPOR

-VSS

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on Reset

signal

SVDD

0.05

V/ms See section on Power-on Reset for details

D005

Brown-out Reset Voltage

VBOR

3.7

4.0

4.35

BODEN bit in configuration word enabled

D010

D010A

Supply Current (Note 2,5) IDD

0.6

2.0

µA

XT, RC osc configuration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

LP osc configuration

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

D015*

Brown-out Reset Current

(Note 6)

∆IBOR

-85

200

µA

BOR enabled VDD = 5.0V

D020

D021

D021A

Power-down Current

(Note 3,5)

IPD

7.5

0.8

0.9

4.5

µA

VDD = 3.0V, WDT enabled, -40

°C to +85°C

VDD = 3.0V, WDT disabled, 0

°C to +70°C

VDD = 3.0V, WDT disabled, -40

°C to +85°C

D023*

Brown-out Reset Current

(Note 6)

∆IBOR

-85

200

µA

BOR enabled VDD = 5.0V

Legend: * These parameters are characterized but not tested.

† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20

µA to the specification. This value is from charac-

terization and is for design guidance only. This is not tested.

6: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

PIC16F870/P Datasheet(PDF) 122 Page - Microchip Technology

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