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PIC16F870/P Datasheet(PDF) 144 Page - Microchip Technology

Part # PIC16F870/P
Description  28/40-Pin 8-Bit CMOS FLASH Microcontrollers
PDF  156 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F870/P Datasheet(HTML) 144 Page - Microchip Technology

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PIC16F870/871
DS30569A-page 144
Preliminary
© 1999 Microchip Technology Inc.
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
CH2 x 45
°
CH1 x 45
°
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.53
0.51
0.33
.021
.020
.013
B
0.81
0.74
0.66
.032
.029
.026
B1
Upper Lead Width
0.33
0.27
0.20
.013
.011
.008
c
Lead Thickness
11
11
n1
Pins per Side
16.00
15.75
14.99
.630
.620
.590
D2
Footprint Length
16.00
15.75
14.99
.630
.620
.590
E2
Footprint Width
16.66
16.59
16.51
.656
.653
.650
D1
Molded Package Length
16.66
16.59
16.51
.656
.653
.650
E1
Molded Package Width
17.65
17.53
17.40
.695
.690
.685
D
Overall Length
17.65
17.53
17.40
.695
.690
.685
E
Overall Width
0.25
0.13
0.00
.010
.005
.000
CH2
Corner Chamfer (others)
1.27
1.14
1.02
.050
.045
.040
CH1
Corner Chamfer 1
0.86
0.74
0.61
.034
.029
.024
A3
Side 1 Chamfer Height
0.51
.020
A1
Standoff
A2
Molded Package Thickness
4.57
4.39
4.19
.180
.173
.165
A
Overall Height
1.27
.050
p
Pitch
44
44
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
β
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
α
p
A3
A
35
°
B1
B
D2
A1
.145
.153
.160
3.68
3.87
4.06
.028
.035
0.71
0.89
Lower Lead Width
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048



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