PIC16C641-04SLASHTQ datasheet(112/136 Pages) MICROCHIP

112 / 136 page

PIC16C64X & PIC16C66X

DS30559A-page 112

Preliminary

14.1

Package Marking Information

Legend: MM...MMicrochip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

C = Chandler, Arizona, U.S.A.

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next

line thus limiting the number of available characters for customer speciﬁc information.

*Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and

assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip

Sales Ofﬁce. For QTP devices, any special marking adders are included in QTP price.

XXXXXXXXXXXXXXX

AABBCDE

28-Lead PDIP (Skinny DIP)

MMMMMMMMMMMM

AABBCDE

Example

PIC16C642-10/SP

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

AABBCDE

MMMMMMMMMMMMMMMM

Example

945/CAA

PIC16C642-10/SO

Example

28-Lead Side Brazed Skinny Windowed

XXXXXXXXXXX

AABBCDE

PIC16C642/JW

9517CAT

PIC16C641-04/TQ Datasheet(PDF) 112 Page - Microchip Technology