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FDC2114RGHT Datasheet(PDF) 6 Page - Texas Instruments

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Part # FDC2114RGHT
Description  EMI-Resistant 28-Bit,12-Bit Capacitance-to-Digital Converter
PDF  61 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

FDC2114RGHT Datasheet(HTML) 6 Page - Texas Instruments

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FDC2212, FDC2214, FDC2112, FDC2114
SNOSCZ5A – JUNE 2015 – REVISED JUNE 2015
www.ti.com
8.5 Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = 25°C, VDD = 3.3 V
(1)
PARAMETER
TEST CONDITIONS(2)
MIN(3)
TYP(4)
MAX(3)
UNIT
POWER
VDD
Supply voltage
TA = –40°C to +125°C
2.7
3.6
V
IDD
Supply durrent (not including
CLKIN = 10MHz(6)
2.1
mA
sensor current)(5)
IDDSL
Sleep mode supply current(5)
35
60
µA
ISD
Shutdown mode supply current(5)
0.2
1
µA
CAPACITIVE SENSOR
CSENSORMAX
Maximum sensor capacitance
1mH inductor, 10kHz oscillation
250
nF
CIN
Sensor pin parasitic capacitance
4
pF
NBITS
Number of bits
FDC2112, FDC2114
12
bits
RCOUNT
≥ 0x0400
FDC2212, FDC2214
28
bits
RCOUNT = 0xFFFF
fCS
Maximum channel sample rate
FDC2112, FDC2114
single active channel continuous
13.3
kSPS
conversion, SCL = 400 kHz
FDC2212, FDC2214
single active channel continuous
4.08
kSPS
conversion, SCL= 400 kHz
EXCITATION
fSENSOR
Sensor excitation frequency
TA = –40°C to +125°C
0.01
10
MHz
VSENSORMIN
Minimum sensor oscillation
1.2
V
amplitude (pk)(7)
VSENSORMAX
Maximum sensor oscillation
1.8
V
amplitude (pk)
ISENSORMAX
Sensor maximum current drive
HIGH_CURRENT_DRV = b0
DRIVE_CURRENT_CH0 =
1.5
mA
0xF800
HIGH_CURRENT_DRV = b1
DRIVE_CURRENT_CH0 =
6
mA
0xF800
Channel 0 only
MASTER CLOCK
fCLKIN
External master clock input
TA = –40°C to +125°C
2
40
MHz
frequency (CLKIN)
CLKINDUTY_MIN
External master clock minimum
40%
acceptable duty cycle (CLKIN)
CLKINDUTY_MAX
External master clock maximum
60%
acceptable duty cycle (CLKIN)
VCLKIN_LO
CLKIN low voltage threshold
0.3*VDD
V
(1)
Electrical Characteristics values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in
very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables
under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which
the device may be permanently degraded, either mechanically or electrically.
(2)
Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal
values have no prefix.
(3)
Limits are ensured by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(4)
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(5)
I2C read/write communication and pull-up resistors current through SCL, SDA not included.
(6)
Sensor capacitor: 1 layer, 20.9 x 13.9 mm, Bourns CMH322522-180KL sensor inductor with L=18µH and 33pF 1% COG/NP0 Target:
Grounded aluminum plate (176 x 123 mm), Channel = Channel 0 (continuous mode) CLKIN = 40 MHz, CHx_FIN_SEL = b10,
CHx_FREF_DIVIDER = b00 0000 0001 CH0_RCOUNT = 0xFFFF, SETTLECOUNT_CH0 = 0x0100, DRIVE_CURRENT_CH0 = 0x7800.
(7)
Lower VSENSORMIN oscillation amplitudes can be used, but will result in lower SNR.
6
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114



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