TAS3108DCPR datasheet(55/63 Pages) TI1

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9.2 Recommended Oscillator Circuit

Osc

Circuit

AVSS

TAS3108/TAS3108IA

S0114-01

9.3 Recommended PCB Design for TAS3108IA Applications

TAS3108, TAS3108IA

AUDIO DIGITAL SIGNAL PROCESSORS

SLES152B – OCTOBER 2005 – REVISED NOVEMBER 2007

• MCLKI and XTLI are logically ORed together, meaning that when the XTALI pin is used, the MCLKI pin

must be grounded.

• Crystal type = Parallel-mode, fundamental-mode crystal

• r

d = Drive-level control resistor – vendor specified

• C

L = Crystal load capacitance (capacitance of circuitry between the two terminals of the crystal)

• C

L = (C1 × C2)/C1 + C2) + CS (where CS = board stray capacitance, ~2 pF)

Automotive applications require that the TAS3108IA operates properly while in an ambient temperature

range of –40

° C to 105°C. Under the high-temperature condition of 105°C ambient, the TAS3108IA

thermal pad must be soldered to a copper area on the PCB designed for thermal relief.

High-temperature applications also require that the application be built on a high-K dielectric PCB.

High-K dielectric PCB requirements for using TAS3108IA with soldered thermal pad:

• 0.062 in thick

• Minimum 3-in × 3-in PCB

• 2-oz copper traces located on top of the board (0,071 mm thick)

• Copper area located on the top and bottom of the PCB for soldering

• Power and ground planes, 1-oz. copper (0,036 mm thick)

• Thermal vias, 0.3-mm diameter, 1.5-mm pitch

• Thermal isolation of power plane

If the target application limits the ambient temperature to 0

°C to 70°C (standard commercial

temperature range), the thermal pad does not need to be soldered to the PCB.

For more information, see PowerPAD™ Thermally Enhanced Package (SLMA002) and PowerPADTM

Made Easy (SLMA004).

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Application Information

Not Recommended for New Designs

TAS3108DCPR Datasheet(PDF) 55 Page - Texas Instruments