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LE25S161 Datasheet(PDF) 7 Page - ON Semiconductor

Part # LE25S161
Description  Serial Flash Memory
PDF  54 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

LE25S161 Datasheet(HTML) 7 Page - ON Semiconductor

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LE25S161
www.onsemi.com
7
Package Dimensions
unit : mm
LE25S161PCTXG
UDFN8, 4x3, 0.8P
CASE 506DC
ISSUE O
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
MIN
MAX
MILLIMETERS
A
0.50
0.60
A1
0.00
0.05
A3
0.152 REF
b
0.25
0.35
D
4.00 BSC
D2
0.70
0.90
E
3.00 BSC
E2
0.10
0.30
e
0.80 BSC
L
0.55
0.65
D
B
E
C
0.15
A
C
0.15
2X
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
C
A
(A3)
A1
10X
SEATING
PLANE
C
0.08
C
0.10
e
8X
L
E2
D2
b
NOTE 3
1
4
5
8
8X
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
= Pb-Free Package
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
AYWW
*This information is generic. Please refer to
device data sheet for actual part marking.
PIN ONE
REFERENCE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
8X
0.83
2.60
8X
0.80
PITCH
0.40
(Note: Microdot may be in either location)
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1
0.15
DETAIL B
NOTE 4
DETAIL A
DIMENSIONS: MILLIMETERS
PACKAGE
OUTLINE
e/2
A
M
0.10
B
C
M
0.05
C
SOLDERING FOOTPRINT*
A
M
0.10
B
C
2X
2X
G
A
M
0.10
B
C
G
1.60 BSC
1
2X
0.40
3.30
2X
1.00



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