5

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com

Application Support: apps@hittite.com

HMC976LP3E

400mA LOW NOISE, HIGH PSRR

LINEAR VOLTAGE REGULATOR

v02.1112

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC976LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

976

XXX

X

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

[3] For standard HMC976LP3E evaluation board, no heat sink (HS) and no air flow, see figures 14, 15, and 16

Table 2. Absolute Maximum Ratings

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Table 3. Recommended Operating Condition

Vdd to GND Voltage

+5.8V / -0.3V

EN to GND Voltage

+5.8V /-0.3V

RDx / HVx to GND Voltage

+5.8V / -0.3V

Maximum Dissipation

780mW

Thermal Resistance

(Junction to Ambient)

51.5 °C/W [3]

Thermal Resistance (Junction to

Case, Ground Paddle)

18 °C/W

Maximum Junction Temperature

+150 °C

Max Output Current

420 mA

Storage Temperature

-65 to +150 °C

ESD Sensitivity (HBM)

Class 1C

Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This

is a stress rating only; functional operation of the device

at these or any other conditions above those indicated in

the operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. The absolute

maximum ratings apply individually only, not in combination.

NOTES:

[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC

SILICA AND SILICON IMPREGNATED.

[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].

[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

[6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL

BE 0.25m MAX.

[7] PACKAGE WARP SHALL NOT EXCEED 0.05mm

[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB GROUND.

[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND

PATTERN.

Table 4. Package Information

Parameter

Condition

Min.

Typ.

Max.

Units

Junction Temperature

115

°C

Ambient Temperature

-40

85

°C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

For price, delivery, and to place orders: Analog Devices, Inc.,

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D