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HMC976LP3E Datasheet(PDF) 10 Page - Analog Devices

Part # HMC976LP3E
Description  Basestation Infrastructure
PDF  12 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

HMC976LP3E Datasheet(HTML) 10 Page - Analog Devices

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For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com
Application Support: apps@hittite.com
HMC976LP3E
400mA LOW NOISE, HIGH PSRR
LINEAR VOLTAGE REGULATOR
v02.1112
Thermal dissipation should be taken into account at all times especially with large dropout voltages VDD-VR, i.e.
if 1.8V output is required from 5.5V input voltage, then the output current must be restricted to <210mA , or VDD
restricted to <3.75V for a 400mA load.
The exact maximum operating temperature before the thermal protection circuit activates is largely dependent on
the customer PCB design. Below is an example for maximum ambient temperature calculation for the standard
HMC976LP3E evaluation PCB with no heat sink and no air flow (fans). Customers should perform this calculation for
their PCB layout and operating conditions.
VIN=5.5V, Vout=5.0V, Iout=400mA
Vdropout=VIN-VOUT=0.5V
Dissipated power on regulator Pd=0.5Vx0.4A=0.2W
=51.5°C/W
Junction temperature increase using standard HMC976 board: DTj=Pd x
=10.3°C. Thermal shutdown
junction temperature of regulator (absolute min) Tsdwn=+115°C. Maximum corresponding ambient temperature
Ta_max = Tsdwn - DTj = +104.7°C
The plots below show how the PCB ground copper area affects the HMC976LP3E junction temperature for different
HMC976LP3E power dissipation conditions. The following cases are included in the plots:
1. 100 mm2 Copper Area
2. 1000 mm2 Copper Area
3. 2580 mm2 Copper Area HMC976LP3E Evaluation PCB No Heat Sink (HS)
4. 2580 mm2 Copper Area HMC976LP3E Evaluation PCB with Heat Sink (HS)
5. JEDEC Board as per JESD51-3
The typical corresponding
is shown in Table 8:
25
50
75
100
125
150
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
POWER DISSIPATION (W)
Tjmax
JEDEC no HS
2580mm
2 with HS
2580mm
2 no HS
1000mm
2 no HS
100mm
2 no HS
115°C WORST CASE
THERMAL SHUTDOWN
25
50
75
100
125
150
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
POWER DISSIPATION (W)
100mm
2 no HS
2580mm
2 with HS
2580mm
2 no HS
1000mm
2 no HS
Tjmax
JEDEC no HS
115°C WORST CASE
THERMAL SHUTDOWN
Table 8. Typical
for specified PCB Copper Sizes
Copper size (mm2)
(
°C/W)
100
173.5
1000
57.3
2580 no HS
51.5
2580 with HS
44
θja
θja
θja
θja
Figure 14. HMC976LP3E JUNCTION TEMPERATURE
°C vs. TOTAL POWER DISSIPATION 25°C AMBIENT
Figure 15. HMC976LP3E JUNCTION TEMPERATURE
°C vs. TOTAL POWER DISSIPATION 50°C AMBIENT
θja
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D



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