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HMC976LP3E Datasheet(PDF) 10 Page - Analog Devices |
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HMC976LP3E Datasheet(HTML) 10 Page - Analog Devices |
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10 / 12 page ![]() 10 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com Application Support: apps@hittite.com HMC976LP3E 400mA LOW NOISE, HIGH PSRR LINEAR VOLTAGE REGULATOR v02.1112 Thermal dissipation should be taken into account at all times especially with large dropout voltages VDD-VR, i.e. if 1.8V output is required from 5.5V input voltage, then the output current must be restricted to <210mA , or VDD restricted to <3.75V for a 400mA load. The exact maximum operating temperature before the thermal protection circuit activates is largely dependent on the customer PCB design. Below is an example for maximum ambient temperature calculation for the standard HMC976LP3E evaluation PCB with no heat sink and no air flow (fans). Customers should perform this calculation for their PCB layout and operating conditions. VIN=5.5V, Vout=5.0V, Iout=400mA Vdropout=VIN-VOUT=0.5V Dissipated power on regulator Pd=0.5Vx0.4A=0.2W =51.5°C/W Junction temperature increase using standard HMC976 board: DTj=Pd x =10.3°C. Thermal shutdown junction temperature of regulator (absolute min) Tsdwn=+115°C. Maximum corresponding ambient temperature Ta_max = Tsdwn - DTj = +104.7°C The plots below show how the PCB ground copper area affects the HMC976LP3E junction temperature for different HMC976LP3E power dissipation conditions. The following cases are included in the plots: 1. 100 mm2 Copper Area 2. 1000 mm2 Copper Area 3. 2580 mm2 Copper Area HMC976LP3E Evaluation PCB No Heat Sink (HS) 4. 2580 mm2 Copper Area HMC976LP3E Evaluation PCB with Heat Sink (HS) 5. JEDEC Board as per JESD51-3 The typical corresponding is shown in Table 8: 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 POWER DISSIPATION (W) Tjmax JEDEC no HS 2580mm 2 with HS 2580mm 2 no HS 1000mm 2 no HS 100mm 2 no HS 115°C WORST CASE THERMAL SHUTDOWN 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 POWER DISSIPATION (W) 100mm 2 no HS 2580mm 2 with HS 2580mm 2 no HS 1000mm 2 no HS Tjmax JEDEC no HS 115°C WORST CASE THERMAL SHUTDOWN Table 8. Typical for specified PCB Copper Sizes Copper size (mm2) ( °C/W) 100 173.5 1000 57.3 2580 no HS 51.5 2580 with HS 44 θja θja θja θja Figure 14. HMC976LP3E JUNCTION TEMPERATURE °C vs. TOTAL POWER DISSIPATION 25°C AMBIENT Figure 15. HMC976LP3E JUNCTION TEMPERATURE °C vs. TOTAL POWER DISSIPATION 50°C AMBIENT θja Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D |
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