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MPC755 Datasheet(PDF) 6 Page - Motorola, Inc

Part # MPC755
Description  RISC Microprocessor Hardware Specifications
PDF  56 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC755 Datasheet(HTML) 6 Page - Motorola, Inc

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
6
Freescale Semiconductor
General Parameters
— Parity checking on both L2 address and data
•
Memory management unit
— 128-entry, two-way set-associative instruction TLB
— 128-entry, two-way set-associative data TLB
— Hardware reload for TLBs
— Hardware or optional software tablewalk support
— Eight instruction BATs and eight data BATs
— Eight SPRGs, for assistance with software tablewalks
— Virtual memory support for up to 4 exabytes (252) of virtual memory
— Real memory support for up to 4 gigabytes (232) of physical memory
•
Bus interface
— Compatible with 60x processor interface
— 32-bit address bus
— 64-bit data bus, 32-bit mode selectable
— Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x, 10x
supported
— Selectable interface voltages of 2.5 and 3.3 V
— Parity checking on both address and data buses
•
Power management
— Low-power design with thermal requirements very similar to MPC740/MPC750
— Three static power saving modes: doze, nap, and sleep
— Dynamic power management
•
Integrated thermal management assist unit
— On-chip thermal sensor and control logic
— Thermal management interrupt for software regulation of junction temperature
•
Testability
— LSSD scan design
— IEEE 1149.1 JTAG interface
3 General Parameters
The following list provides a summary of the general parameters of the MPC755:
Technology
0.22 µm CMOS, six-layer metal
Die size
6.61 mm
× 7.73 mm (51 mm2)
Transistor count
6.75 million
Logic design
Fully-static
Packages
MPC745: Surface mount 255 plastic ball grid array (PBGA)
MPC755: Surface mount 360 ceramic ball grid array (CBGA)
Surface mount 360 plastic ball grid array (PBGA)



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