SC68C752B datasheet(46/49 Pages) PHILIPS

46 / 49 page

SC68C752B_3

Product data sheet

Rev. 03 — 29 November 2005

46 of 49

Philips Semiconductors

SC68C752B

5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

14. Abbreviations

Table 29:

Abbreviations

Acronym

Description

CPU

Central Processing Unit

DMA

Direct Memory Access

FIFO

First In/First Out

LSB

Least Signiﬁcant Bit

MSB

Most Signiﬁcant Bit

UART

Universal Asynchronous Receiver and Transmitter

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