HSDL-3003 datasheet(11/21 Pages) HP

Part #	HSDL-3003

Description	IrDA Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver

PDF	21 Pages

Scroll/Zoom	100%

Manufacturer	HP [Agilent(Hewlett-Packard)]

Direct Link	http://www.home.agilent.com

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11 / 21 page

Moisture Proof Packaging

All HSDL-3003 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 4.

Package

Temp.

Time

In reels

°C

≥ 48 hours

In bulk

100

°C

≥ 4 hours

125

°C

≥ 2 hours

150

°C

≥ 1 hour

Baking should only be done once.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Recommended Storage Conditions

Storage Temperature 10

°C to 30°C

Relative Humidity

below 60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the recom-

mended storage conditions. If

times longer than 72 hours are

needed, the parts must be stored

in a dry box.

Figure 14. Baking conditions chart.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 25°C,

AND LESS THAN

60% RH?

PACKAGE IS

OPENED MORE

THAN 72 HOURS?

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

HSDL-3003 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard)

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