HSDL-3003 datasheet(14/21 Pages) HP

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Figure 18. Solder stencil aperture.

1.2 Recommended Metal Solder

Stencil Aperture

It is recommended that only a

0.152 mm (0.006 inch) or a

0.127 mm (0.005 inch) thick

stencil be used for solder paste

printing. This is to ensure

adequate printed solder paste

volume and no shorting. See the

table below the drawing for

combinations of metal stencil

aperture and metal stencil

thickness that should be used.

Aperture opening for shield pad

is 3.05 mm x 1.1 mm as per land

pattern.

Aperture size(mm)

Stencil thickness, t (mm)

length, l

width, w

0.152 mm

2.60

± 0.05

0.55

± 0.05

0.127 mm

3.00

± 0.05

0.55

± 0.05

1.3 Adjacent Land Keepout and

Solder Mask Areas

Adjacent land keepout is the

maximum space occupied by

the unit relative to the land

pattern. There should be no other

SMD components within this

area.

The minimum solder resist strip

width required to avoid solder

bridging adjacent pads is 0.2

mm.

It is recommended that two

fiducial crosses be placed at mid-

length of the pads for unit

alignment.

Note: Wet/Liquid Photo-

Imageable solder resist/mask is

recommended.

Figure 19. Adjacent land keepout and solder mask areas.

APERTURES AS PER

LAND DIMENSIONS

0.2

3.0

10.1

3.85

SOLDER MASK

UNITS: mm

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