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CF52012 Datasheet(PDF) 6 Page - Intel Corporation |
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CF52012 Datasheet(HTML) 6 Page - Intel Corporation |
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6 / 48 page ![]() Symbol Parameter Condition Min Max Unit IMAX DC VCC or GND current — — 20 mA IOUT DC output current per pin — –25 25 mA PD Power dissipation — — 72 mW TSTG Storage temperature No bias –65 150 °C TJ Junction temperature Under bias — 125 °C 1.3.2. Recommended Operating Conditions Table 3. Recommended Operating Conditions Symbol Parameter Condition Min Max Unit VCC Supply voltage (4) 2.7 3.6 V VI Input voltage With respect to GND -0.5 0.4 + VCC V VO Output voltage — 0 VCC V TA (5) Operating temperature For industrial use -40 85 °C tR Input rise time for all devices except EPCQ512/A — — 5 ns Input rise time for EPCQ512/A — — 1.5 ns tF Input fall time for all devices except EPCQ512/A — — 5 ns Input fall time for EPCQ512/A — — 1.5 ns Related Information EPCQ Package and Thermal Resistance Provides more information about EPCQ thermal resistance. 1.3.3. DC Operating Conditions Table 4. DC Operating Conditions Symbol Parameter Condition Min Max Unit VIH High-level input voltage — 0.7 x VCC VCC + 0.4 V VIL Low-level input voltage — -0.5 0.3 x VCC V VOH High-level output voltage IOH = -100 µA (6) VCC - 0.2 — V continued... (3) For periods of less than 2 ns, VIL can undershoot to –1.0 V and VIH can overshoot to VCC + 1.0 V. (4) The maximum VCC rise time is 100 ms. (5) EPCQ devices can be paired with Intel FPGA industrial-grade FPGAs operating at junction temperatures up to 100°C as long as the ambient temperature does not exceed 85°C. (6) The IOH parameter refers to the high-level TTL or CMOS output current. 1. Quad-Serial Configuration (EPCQ) Devices Datasheet CF52012 | 2018.06.01 Quad-Serial Configuration (EPCQ) Devices Datasheet 6 |
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