Revised Date:

March 20, 2013

ds_pl2303HXD_v1.4.4

PL-2303HX (Rev D) Product Datasheet

- 12 -

Document Version 1.4.4

4.2

QFN32 Package

NC

G N D

V D D _ 3 2 5

R XD

R I _N

G N D

V D D _ 3 3

D SR _N

D C D _N

C T S_N

G P 1

G P 0

NC

V D D _ 5

R ESET _N

V O _ 3 3

PL-2303HXD

Exposed Die Pad connects to VO_33

1

Figure 4-2 Pin Assignment Outline of PL-2303HX (Rev D) QFN32

Warning: The exposed center die pad of the PL-2303HX QFN package is connected (bonded) to the

pin VO_33 so it is very important to design the PCB layout wherein this exposed die pad

won’t get grounded on the PCB when mounted.