UPD78044F datasheet(52/66 Pages) NEC

52 / 66 page

µPD78F0034A, 78F0034AY

Data Sheet U14040EJ4V0DS

9. RECOMMENDED SOLDERING CONDITIONS

The

µPD78F0034A, 78F0034AY should be soldered and mounted under the following recommended conditions.

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 9-1. Surface Mounting Type Soldering Conditions (1/2)

(1)

µPD78F0034AGC-8BS: 64-pin plastic LQFP (14 × 14)

µPD78F0034AYGC-8BS: 64-pin plastic LQFP (14 × 14)

µPD78F0034AGC-AB8: 64-pin plastic QFP (14 × 14)

µPD78F0034AYGC-AB8: 64-pin plastic QFP (14 × 14)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or higher),

IR35-00-2

Count: Two times or less

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C or higher),

VP15-00-2

Count: Two times or less

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 seconds max., Count: Once,

WS60-00-1

Preheating temperature: 120

°C max. (package surface temperature)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)

–

Caution Do not use different soldering methods together (except for partial heating).

(2)

µPD78F0034AGB-8EU: 64-pin plastic LQFP (10 × 10)

µPD78F0034AYGB-8EU: 64-pin plastic LQFP (10 × 10)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or higher),

IR35-107-2

Count: Two times or less,

Exposure limit: 7 daysNote (after 7 days, prebake at 125

°C for 10 hours)

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C or higher),

VP15-107-2

Count: Two times or less,

Exposure limit: 7 daysNote (after 7 days, prebake at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)

–

Note

After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

UPD78044F Datasheet(PDF) 52 Page - NEC

UPD78044F Datasheet(HTML) 52 Page - NEC

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