UPD78044F datasheet(53/66 Pages) NEC

53 / 66 page

µPD78F0034A, 78F0034AY

Data Sheet U14040EJ4V0DS

Table 9-1. Surface Mounting Type Soldering Conditions (2/2)

(3)

µPD78F0034AGK-9ET: 64-pin plastic TQFP (12 × 12)

µPD78F0034AYGK-9ET: 64-pin plastic TQFP (12 × 12)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or higher),

IR35-107-2

Count: Two times or less,

Exposure limit: 7 daysNote (after 7 days, prebake at 125

°C for 10 hours)

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C or higher),

VP15-107-2

Count: Two times or less,

Exposure limit: 7 daysNote (after 7 days, prebake at 125

°C for 10 hours)

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 seconds max.,

WS60-107-1

Count: Once, Preheating temperature: 120

°C max. (package surface temperature),

Exposure limit: 7 daysNote (after 7 days, prebake at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)

–

Note

After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Table 9-2. Insertion Type Soldering Conditions

µPD78F0034ACW: 64-pin plastic SDIP (19.05 mm (750))

µPD78F0034AYCW: 64-pin plastic SDIP (19.05 mm (750))

Soldering Method

Soldering Conditions

Wave soldering (pin only)

Solder bath temperature: 260

°C max., Time: 10 seconds max.

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with

the package.

UPD78044F Datasheet(PDF) 53 Page - NEC

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