High Current Connectors P4SP (0.4 mm pitch)

Panasonic Corporation Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

ACCTB112E 202003

Panasonic Corporation 2020

Characteristics

Item

Specifications

Conditions

Electrical

characteristics

Rated

current

Power contact

—

Signal contact

As power contact: 1.0 A/pin contact × 10 pins

As signal contact: 0.5 A/pin contact

(Max. 12 A at total pin contacts)

Rated voltage

30 V AC/DC

Dielectric strength

150 V AC for 1 min.

No short-circuiting or damage at a detection current

of 1 mA when the specified voltage is applied for one

minute.

Insulation resistance

Min. 1,000 MΩ (initial)

Using 250 V DC megger (applied for 1 min.)

Contact resistance

Max. 40 mΩ

Based on the contact resistance measurement

method specified by JIS C 5402.

Mechanical

characteristics

Composite insertion force

Max. 0.981 N/pin contact × pin contacts (initial)

Composite removal force

Min. 0.0588 N/pin contact × pin contacts

Environmental

characteristics

Ambient temperature

–55 to +85°C

No icing. No condensation.

Soldering heat resistance

The initial specification must be satisfied

electrically and mechanically.

Reflow soldering:

Peak temperature: 260°C or less

(on the surface of the PC board around the

connector terminals)

Soldering iron: 300°C within 5 sec. 350°C within 3 sec.

Storage temperature

–55 to +85°C (product only)

–40 to +50°C (emboss packing)

No icing. No condensation.

Thermal shock resistance

(header and socket mated)

5 cycles,

insulation resistance Min. 100 MΩ,

contact resistance Max. 40 mΩ

Order

Time (minutes)

1

2

3

4

30

Max. 5

30

Max. 5

Conformed to MIL-STD-202F, method 107G

+3

0

85

0

0

Humidity resistance

(header and socket mated)

120 hours,

insulation resistance Min. 100 MΩ,

contact resistance Max. 40 mΩ

Conformed to IEC60068-2-78

Temperature 40±2°C, humidity 90 to 95% RH

Saltwater spray resistance

(header and socket mated)

24 hours,

insulation resistance Min. 100 MΩ,

contact resistance Max. 40 mΩ

Conformed to IEC60068-2-11

Temperature 35±2°C, saltwater concentration 5±1%

(header and socket mated)

48 hours,

contact resistance Max. 40 mΩ

Temperature 40±2°C, gas concentration 3±1 ppm,

humidity 75 to 80% RH

Lifetime

characteristics Insertion and removal life

50 times

Repeated insertion and removal speed of Max. 200

times/hour

Unit weight

20 pins Socket: 0.04 g

20 pins Header: 0.02 g

SPECIFICATIONS

Material and surface treatment

Part name

Material

Surface treatment

Molded portion

LCP resin (UL94V-0)

—

Contact and Post

Copper alloy

Contact portion: Base: Ni plating, Surface: Au plating

Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)

The socket terminals close to the portion to be soldered have nickel barriers

(exposed nickel portions).

Soldering terminals

Copper alloy

Sockets:

Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)

Headers:

Base: Ni plating, Surface: Au plating (except the terminal tips)

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