High Current Connectors P4SP (0.4 mm pitch)

Panasonic Corporation Electromechanical Control Business Division

industrial.panasonic.com/ac/e/

ACCTB112E 202003

Panasonic Corporation 2020

NOTES

Unit: mm

Design of PC board patterns

Conduct the recommended foot pattern design, in order to

preserve the mechanical strength of terminal solder areas.

Recommended PC board and metal mask patterns

Connectors are mounted with high pitch density, intervals of

0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and

flux rise, solder bridges and other issues make sure the proper

levels of solder is used.

The figures are recommended patterns. Please use them as a

reference.

Socket (Mated height 1.5 mm, 2.5 mm, 3.0 mm)

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150 μm

(Terminal opening ratio: 48%)

(Metal-part opening ratio: 100%)

Recommended metal mask pattern

Metal mask thickness: When 120 μm

(Terminal opening ratio: 60%)

(Metal-part opening ratio: 100%)

0.95±0.03

0.40±0.03

0.23±0.03

0.70±0.03

0.95±0.01

0.20±0.01

0.70±0.01

0.40±0.01

0.95±0.01

0.40±0.01

0.20±0.01

0.70±0.01

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