6.4 Thermal Information

THERMAL METRIC(1)

DS160PR41

2,

DS160PR42

1

UNIT

RUA, 42

Pins

K

Junction-to-ambient thermal resistance

26.1

℃/W

14.1

℃/W

Junction-to-board thermal resistance

8.7

℃/W

Junction-to-top characterization parameter

1.6

℃/W

Junction-to-board characterization parameter

8.6

℃/W

2.6

℃/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

6.5 DC Electrical Characteristics

over operating free-air temperature and voltage range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Power

Active power per channel

GAIN1/0 = L3

120

mW

GAIN1/0 = L0

110

mW

Device current consumption when four

channels are active

GAIN1/0 = L3, PD = L

145

190

mA

Device current consumption in standby

power mode

All channels disabled (PD = H)

30

45

mA

Internal regulator output

2.5

V

Control IO

High level input voltage

SDA, SCL, PD, SEL pins

2.1

V

Low level input voltage

SDA, SCL, PD, SEL pins

1.08

V

High level output voltage

2.1

V

Low level output voltage

0.4

V

80

µA

Input high leakage current

10

µA

Input low leakage current

-10

µA

Input high leakage current for fail safe

input pins

PD, SEL pins)

150

µA

Input capacitance

SDA, SCL, PD, SEL pins

1.5

pF

4 Level IOs (MODE, GAIN, EQ0, EQ1, RX_DET pins)

Input high leakage current, 4 level IOs VIN = 2.5 V

10

µA

Input low leakage current for all 4 level

IOs except MODE.

VIN = GND

-10

µA

Input low leakage current for MODE

pin

VIN = GND

-200

µA

Receiver

RX DC Common Mode (CM) Voltage

Device is in active or standby state

2.5

V

Rx DC Single-Ended Impedance

50

Ω

DC-POS

DC input CM input impedance during

Reset or power-down

Inputs are at CM voltage

20

kΩ

Transmitter

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DS160PR412

SNLS685 – DECEMBER 2020

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