K32L2AX datasheet(52/96 Pages) NXP

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Table 21. General switching specifications

Description

Min.

Max.

Unit

Notes

• Fast slew rate

• Slow slew rate

• 1.71 ≤ VDD ≤ 2.7 V

• Fast slew rate

• Slow slew rate

High drive enabled

• 2.7 ≤ VDD ≤ 3.6 V

• Fast slew rate

• Slow slew rate

• 1.71 ≤ VDD ≤ 2.7 V

• Fast slew rate

• Slow slew rate

—

1. The synchronous and asynchronous timing must be met.

2. This is the shortest pulse that is guaranteed to be recognized.

3. For high drive pins with high drive enabled, load is 75pF; other pins load (normal/low drive) is 25pF. Fast slew rate is

enabled by clearing PORTx_PCRn[SRE].

4. High drive pins are PTB0,PTB1, PTC3, and PTC4. High drive capability is enabled by setting PORTx_PCRn[DSE].

5. Normal drive fast pins are PTE20, PTE21, PTE22, and PTE23.

6. High drive fast pins are PTD4, PTD5, PTD6, and PTD7. High drive capability is enabled by setting PORTx_PCRn[DSE].

NOTE

Only PTA4, PTA20, and PTB19 pins have analog/passive

filter.

7.4 Thermal specifications

7.4.1 Thermal operating requirements

Table 22. Thermal operating requirements

Symbol

Description

Min.

Max.

Unit

Notes

Die junction temperature

–40

125

°C

Ambient temperature

–40

105

°C

1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed the maximum. The simplest method to

determine TJ is: TJ = TA + RθJA × chip power dissipation.

General

K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021

NXP Semiconductors

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