EDSTRG28PLCCCX datasheet(52/78 Pages) TI

52 / 78 page

RELIABILITY STRESS TESTS

2–6

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Table 2. Definitions of Microprocessor Testing Terms

TERM

DEFINITION/DESCRIPTION

REFERENCES

Average Outgoing Quality (AOQ)

Amount of defective product in a population, usually expressed

in terms of parts per million (PPM)

Failure in Time (FIT)

Estimated field failure rate in number of failures per billion

power-on device hours; 1000 FITS equal 0.1% failures per

1000 device hours.

Operating Life

Device dynamically exercised at a high ambient temperature

(usually 125

°C) to simulate field usage that would expose the

device to a much lower ambient temperature (such as 55

°C).

Using a derived high temperature, a 55

°C ambient failure rate

can be calculated.

Storage Life

Device exposed to 150

°C unbiased condition. Bond integrity is

stressed in this environment.

Biased Humidity

Moisture and bias used to accelerate corrosion-type failures in

plastic

packages.

Conditions

include

°C ambient

temperature with 85% relative humidity (RH). Typical bias

voltage is 5 V and is grounded on alternating pins.

Autoclave (Pressure Cooker)

Plastic-packaged devices exposed to moisture at 121

°C using

a pressure of one atmosphere above normal pressure. The

pressure forces moisture permeation of the package and

accelerates corrosion mechanisms (if present) on the device.

External package contaminants can also be activated and

caused to generate inter-pin current leakage paths.

Temperature Cycle

Device exposed to severe temperature extremes in an

alternating fashion (–65

°C for 15 minutes and 150°C for

15 minutes per cycle) for at least 1000 cycles. Package

strength, bond quality, and consistency of assembly process

are tested in this environment.

Electrostatic Discharge (ESD)

Device exposed to electrostatic discharge pulses.

Calibration is according to MIL STD 883C, method 3015.6.

Devices are stressed to determine failure threshold of the

design.

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